REBON Daim tawv nqaij-phooj ywg Board-ENF Qib & Nano Technology

Los ntawm cov khoom ntoo mus rau cov khoom vaj khoom tsev, los ntawm cov khoom vaj khoom tsev mus rau cov khoom siv zoo nkauj, REBON tau tsim kho tshiab los ntawm kev tshawb nrhiav. Lub Rooj Tswjhwm Saib REBON tshiab ntawm daim tawv nqaij tsis txwv rau cov tsos, tab sis tseem txuas ntxiv mus rau qhov kev paub tactile, uas zoo kawg nkaus ua ke nrog kev tiv thaiv ib puag ncig ntsuab thiab cov tawv nqaij xis nyob uas tib neeg tau saib xyuas tam sim no, muab lub rooj tsavxwm rau cov tawv nqaij zoo. kev xav thiab tsim kom muaj qhov chaw zoo tshaj plaws uas kev nplij siab thiab kev zoo sib koom ua ke.

Nrog rau kev kho dua tshiab ntawm lub tswv yim noj ntawm lub neej hauv tsev thiab kev tsim kho tshiab ntawm cov khoom siv tshiab thiab cov thev naus laus zis tshiab, tib neeg cov kev xav tau rau kev ua haujlwm hauv tsev, kov thiab pom kev tau dhau los ua kom ntxaws. Txhawm rau ua kom tau raws li qhov xav tau ntawm cov neeg siv khoom sib txawv, DE&E Smart Home tau teeb tsa lub chaw tshawb fawb nkaus xwb rau vaj huam sib luag kho kom zoo nkauj hauv tsev hauv kev lag luam, tsim kho tshiab thiab tsim kho tawv nqaij nanotechnology, thiab nthuav tawm "REBON Skin-friendly Board".

REBON daim tawv nqaij-phooj ywg lub rooj sib txuas ua ke HF nano-excimer technology thiab kev lag luam-ua nano-txheej thev naus laus zis los tsim kom muaj kev sib haum xeeb hauv tsev rau tib neeg los ntawm kev xav ntawm kov, tsis pom kev, kev ntxhib los mos thiab kev tiv thaiv ib puag ncig.

Tom qab muaj kev sib kis, tib neeg tau paub ntau ntxiv txog qhov tseem ceeb ntawm kev noj qab haus huv hauv tsev thiab kev tiv thaiv ib puag ncig, tab sis txawm li cas los xij, nws tseem nyuaj kom tsis txhob muaj kev ua txhaum ntawm formaldehyde hauv cov rooj tog zaum hauv tsev, vim nws feem ntau muaj nyob rau hauv cov khoom siv kho kom zoo nkauj, xws li cov khoom siv kho kom zoo nkauj. thiab wardrobes ntawm lub khw, uas feem ntau muaj ib tug tej yam degree ntawm formaldehyde.

REBON daim tawv nqaij-phooj ywg board txais cov feem ntau ib puag ncig-phooj ywg ecological nplaum nyob rau hauv tam sim no, zoo kawg nkaus zam cov feem ntau siv urea-formaldehyde resin nplaum nplaum nplua nuj nyob rau hauv formaldehyde nyob rau hauv kev ua lag luam. Cov txheej txheem kev tiv thaiv ib puag ncig tau mus txog qib thoob ntiaj teb ENF nrog kev tiv thaiv ib puag ncig siab tshaj plaws rau formaldehyde, tsis muaj formaldehyde thiab tsw, noj qab haus huv thiab ib puag ncig tus phooj ywg. MDI eco-adhesive no yog cov khoom siv hluavtaws hluavtaws. Vim nws zoo heev kev nyab xeeb thiab ruaj khov, nws yog dav siv nyob rau hauv lub plawv li qub, cov hlab ntsha dag, cov khoom siv dag zog thiab lwm yam.

Kov ib txwm yog txoj hauv kev tseem ceeb rau peb kom pom lub ntiaj teb. Kov lub rooj tsavxwm REBON ntawm daim tawv nqaij tuaj yeem xa cov kev ntxhib los mos ntawm qhov chaw mus rau lub ntsis ntiv tes, uas yog mos, muag heev thiab silky li kov tus menyuam daim tawv nqaij, ua rau lub neej mos thiab maj mam.

Qhov no yog feem ntau yog vim muaj kev sib xyaw ua ke ntawm HF nano-txheej thiab cov tawv nqaij ua kom zoo nkauj, uas ua rau lub rooj sib tw ntawm daim tawv nqaij tau plump, thiab cov zaj duab xis ua kom zoo nkauj du thiab muag heev. Ntxiv mus, cov xim ntawm lub rooj tsavxwm saum npoo yog dawb huv, thiab cov xim ceev rau lub teeb yog siab li qib 4, uas tsim cov qib siab ntawm daim tawv nqaij-xws li luster thiab sublimates cov nyhuv pom.

HF nano-excimer thev naus laus zis thiab HF nano-txheej thev naus laus zis ntawm REBON daim tawv nqaij-phooj ywg board kuj tau tsim tsib lub zog loj ntawm lub rooj tsavxwm:
Scratch Resistance:AF thev naus laus zis siv cov txheej txheem tshwj xeeb evaporation, lub hardness ntawm lub rooj tsavxwm saum npoo yog siab li 8H, thiab nws tsis ntshai ntawm kev kub hnyiab los ntawm npib; imported high-toughness cov ntaub ntawv yuav restructure lub microscopic nto qauv, thiab nws tus kheej-kho rau me ntsis khawb.
Deformation kuj:Cov qauv ntawm cov khoom siv hauv paus yog precisely tsim los ntawm lub computer, thiab qhov ceev yog siab dua thiab ruaj khov; adhesion ntawm cov xim zaj duab xis mus txog qib siab tshaj plaws ntawm qib 0, thiab nws yuav tsis cais tom qab siv mus ntev; ob-sided txheej yog kho nrog cov cuab yeej siv zog, thiab qhov kawg tsis deformed.
Corrosion Resistance:AF + HF dual-technology txau cov cuab yeej tsim cov txheej txheem tiv thaiv saum npoo, uas nce mus txog qib siab tshaj 5 corrosion kuj tus qauv, tsis muaj dej tsis muaj dej, noo noo-pov thawj thiab roj-pov thawj, thiab tsis tso cov ntiv tes tawm hauv kev siv txhua hnub.
High Temperature Resistance:4-theem high temperature resistance technology, 300-500 degree ib qho taw tes kub kub kub rau 60 vib nas this yam tsis muaj kev puas tsuaj, qhov kev ua tau zoo tuaj yeem sawv qhov ntsuas.
Finger Stain Resistance:AF anti-fingerprint technology, tuab txheej txheej, zoo hydrophobicity thiab roj repellency, tiv thaiv tus ntiv tes thiab tiv thaiv roj adhesion. Kev siv txhua hnub tsis tso cov ntiv tes tawm, siv mus ntev tsis muaj roj.

Ntau lub rooj tog siv cov nplaum nplaum rau cov hlua khi thiab cov vaj huam sib luag, thiab muaj cov kab sib txuas ua ke thiab qhov khoob ntawm cov pob qij txha, uas tuaj yeem yooj yim los ua qhov chaw yug me nyuam rau cov kab mob thiab cov kab mob. Ntxiv mus, cov ces kaum no nyuaj rau kev ntxuav txhua hnub, thiab dhau sij hawm, lawv tuaj yeem yooj yim los ua kev hem thawj rau kev noj qab haus huv. REBON daim tawv nqaij-phooj ywg lub rooj tsavxwm txais REHAU ntug banding tshuab, uas yog tsim los ua ke, muaj xoom qhov khoob thiab tsis muaj kua nplaum kab, thiab sawv tawm ntawm ntau lub rooj tsavxwm.

Raws li peb txhua tus paub, REHAU yog tus thawj coj hauv kev ua haujlwm ntawm ntug banding. REHAU ABS ntug banding siv los ntawm REBON daim tawv nqaij-phooj ywg board yog ib puag ncig tus phooj ywg thiab biodegradable. Tsis tas li ntawd, kev siv German HOMAG ntug banding tshuab thiab PUR ntug banding kua nplaum ua rau REBON daim tawv nqaij-phooj ywg board muaj zog ruaj khov, zoo dua elasticity, hnav-resistant thiab ruaj tsis deformation.